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Characterization of heterointerfaces in thin-film transistors by cross-sectional transmission electron microscopy

机译:横截面透射电子显微镜表征薄膜晶体管的异料件

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Hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs) are now widely used as elements for active matrix liquid crystal displays. The nanometer-scale multilayered structure of a-Si:H TFTs has been characterized by cross-sectional transmission electron microscopy (TEM). The discrete layer construction of a faulty TFTs and the generation of defects during manufacturing processes have bene investigated. A combination of focused ion beam (FIB) etching and cross-sectional TEM leads to a successful failure analysis. A contamination layer with a thickness of 10-30 nm and microvoids inside multilayers are identified in faulty TFTs. An a-Si layer on silicon nitride (SiN_x) is crystallized during TEM observation. Electron energy loss spectroscopy analysis indicates that the diffusion of nitrogeninto a-Si layer causes the crystallization.
机译:氢化非晶硅薄膜晶体管(A-Si:H TFT)现在广泛地用作有源矩阵液晶显示器的元件。通过横截面透射电子显微镜(TEM)的特征在于A-Si:H TFT的纳米级多层结构。在制造过程中发生故障TFT的离散层构建和制造过程中的缺陷的产生具有BENE研究。聚焦离子束(FIB)蚀刻和横截面TEM的组合导致成功的故障分析。厚度为10-30nm和多层内部微长硼的污染层以故障的TFT鉴定。在TEM观察期间,氮化硅上的A-Si层(SIN_X)结晶。电子能量损失光谱分析表明氮气A-Si层的扩散导致结晶。

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