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SINGLE-STEP THROUGH-HOLE PUNCHING BY HOT EMBOSSING

机译:通过热压法单步穿通孔

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摘要

Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120 ℃ with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.
机译:热微压印是一种有前途的制造技术,可以在热塑性零件中复制毫米到纳米级的特征,包括流体通道。复杂的微流体装置将需要多个功能层以及层间通孔。我们演示了具有集成冲头和模具功能的配对铝工具。冲孔直径约为500μm,740μm,1.0 mm和2.0 mm。压纹通孔在PMMA中于120℃以0.5 mm / min的速度打孔。该工具集还演示了在零件的两侧形成通道并在单个步骤中产生接口端口和层间过孔的可行性。

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