Optimization of film thickness for thermoelectric micro-Peltier cooler

摘要

In this paper, the design of a thin film thermoelectric microcooler module is examined. The module consists of n-type bismuth telluride and p-type antimony telluride thermoelectric materials. The commercial software CFD-ACE+ is used to implement and analyse the model. A two-dimensional coupled electrical and thermal synthesis was performed. The influence of the thickness of the thermoelectric materials on the change in temperature has been investigated. The thickness of the thermoelements was varied between 0.5 and 20 μm. The device performance in terms of change in temperature with and without a load has been studied. The optimal thickness for the thermoelements was found to be 2μm. At 30mA, a temperature difference of 3K below ambient was obtained.