Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards

摘要

Signal path transitions through parallel reference plane structures on printed-circuit boards are investigated. The analysis is based on an equivalent circuit including the interconnect inductances, the signal source and load impedance. All required network elements can be calculated by simple formulas, including simple closed-form expressions for the self and mutual inductances in the central board region. Validation of the predicted network model by measurement shows a good agreement with respect to engineering purposes.