CIRCUIT MODELING OF POWER/GROUND PLANE STRUCTURES FOR PRINTED CIRCUIT BOARDS

摘要

With the increase of operating frequency and circuit-component density, signal/power integrity issues due to ground bounces become more important for high-speed digital systems. This paper presents a modal analysis resulting in a multiport equivalent circuit model for the power/ground plane structures in printed circuit boards including effects of dielectric, conductor, and radiation losses. Numerical results represented in Z-parameters verified by the measured data are shown to validate the proposed approach.