THE IMPACT OF INHIBITOR LEVELS ON CORROSION DURING COPPER CMP

摘要

1-H Benzotriazole (BTA) has been in use for the inhibition of the corrosion of copper metallization during the processing of integrated circuits. This paper discusses the need for control of the BTA concentration during processing. It presents a rapid, in-line, technique for monitoring the BTA concentration through a spectrometric technique; and the resultant improvement in process yield during the chemical-mechanical polishing of damascene copper interconnects.