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Impact of CMP polish and pCMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper

机译：Cmp抛光和pCmp清洗对pECVD衍生的多孔OsG和铜上siCN覆盖层附着力的影响

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D. M. Gage; A. D. W. Thiel; R. H. Dauskardt; M. K. Haas; L. M. Matz; M. L. O’neill; T. M. Wieder; G. Banerjee; M. B. Rao;
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1. Impact of CMP polish and pCMP Cleaning on adhesion of SIGN cappinglayer on PECVD-derived Porous OSG and Copper [J] . D. M. Gage, A.D.W. Thiel, R. H. Dauskardt, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第Null期

机译：CMP抛光和pCMP清洗对SIGN盖层在PECVD衍生的多孔OSG和铜上的附着力的影响
2. Impact of CMP polish and pGMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper [J] . D. M. Gage, A.D.W. Thiel, R. H. Dauskardt, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第0期

机译：CMP抛光和pGMP清洁对PECN衍生的多孔OSG和铜上SiCN覆盖层粘附的影响
3. Impact of CMP polish and pGMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper [J] . D. M. Gage, A.D.W. Thiel, R. H. Dauskardt, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第0期

机译：CMP抛光和pGMP清洁对PECN衍生的多孔OSG和铜上SiCN覆盖层粘附的影响
4. Impact of CMP polish and pCMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper [C] . D. M. Gage, A. D. W. Thiel, R. H. Dauskardt, International Symposium on Ultra Clean Processing of Semiconductor Surfaces . 2009

机译：CMP抛光和PCMP清洁对PECVD衍生多孔OSG和铜粘附性的影响
5. Experimental and molecular dynamics studies in copper electro chemical mechanical polishing (Cu-ECMP). [D] . Kandasamy Arulmozhi, Anant. 2013

机译：铜电化学机械抛光（Cu-ECMP）中的实验和分子动力学研究。
6. Time-Transient Effects of Silver and Copper in the Porous Titanium Dioxide Layer on Antibacterial Properties [O] . Masaya Shimabukuro, Akari Hiji, Tomoyo Manaka, 2020

机译：多孔二氧化钛层中银和铜的时变效应对抗菌性能的影响
7. Preparation of Porous Carbon Membrane Plate (PCMP) from Phenol Resins and Rice Husks with Carbonization under Pressure [O] . Akinori Muto, Aki Hanioka, Thallada Bhaskar, 2004

机译：压力下碳化碳化的多孔碳膜板（PCMP）的制备

Impact of CMP polish and pCMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper

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