机译:表面活性剂在CMP后清洁过程中促进苯并三唑的去除和抑制铜腐蚀的应用
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Hebei Univ Technol, Tianjin Key Lab Elect Mat & Devices, Sch Elect Informat Engn, Tianjin 300130, Peoples R China;
Post-CMP cleaning; Alkaline cleaning solution; Benzotriazole removing; Copper corrosion;
机译:用于CMP和CMP后清洁的基于羟胺的化学品中铜的缓蚀剂
机译:非离子表面活性剂对CMP后清洁的去除作用
机译:草酸水溶液中集成电子微电路“ CMP后清洗”过程中铜图案腐蚀的研究
机译:用于CMP和CMP清洗后羟胺的化学中铜腐蚀抑制剂
机译:5,6-二甲基-1H-苯并三唑:一种新型的苯并三唑缓蚀衍生物以及非离子表面活性剂对其在涂料中的晶体习性的影响
机译:新型阳离子双子表面活性剂的多种应用:抗微生物剂抗生物膜杀生物剂盐度腐蚀抑制剂和生物膜分散体(第二部分)
机译:CIMP清洗后Cu氧化物状态和Cu抑制剂去除的电化学分析
机译:常用苯并三唑类缓蚀剂的生物转化潜力和解偶联行为