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Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding

机译:通过金属热压键合和硅直接键合密封的腔体的泄漏率和残余气体压力

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The residual gas pressure (RGP) in sealed cavities was measured by residual gas analysis (RGA). The cavity sealed by fusion bonding had the lowest RGP of 16 ubar. Cavities sealed by Au-Au thermocompression bonding and plasma bonding had RGPs of 0.18 and 0.22 mbar, respectively. The cavity sealed by Al-Al thermocompression bonding had RGP of 1.3 mbar. Cavities sealed by thermocompression bonding contained 0.16 - 0.21 mbar Ar. The leak rates of the four seal types were estimated by three methods. RGA measurements revealed that the maximum leakage rates were between 10~(-13) and 10~(-15) mbar·l·s~(-1).
机译:通过残留气体分析(RGA)测量密封腔中的残留气体压力(RGP)。通过熔合密封的空腔的最低RGP为16 ubar。通过Au-Au热压键合和等离子键合密封的型腔的RGP分别为0.18和0.22 mbar。通过Al-Al热压键合密封的腔具有1.3mbar的RGP。通过热压粘合密封的腔包含0.16-0.21 mbar Ar。通过三种方法估算了四种密封类型的泄漏率。 RGA测量显示最大泄漏率在10〜(-13)和10〜(-15)mbar·l·s〜(-1)之间。

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    SINTEF ICT, Department of Microsystems and Nanotechnology, Oslo, Norway;

    SINTEF ICT, Department of Microsystems and Nanotechnology, Oslo, Norway,Department of Physics, University of Oslo, Oslo, Norway;

    Memscap AS, Langmyra 11, N-3185 Skoppum, Norway,IMST, Buskerud and Vestfold University College, 3184 Borre, Norway;

    SensoNor, Knudsrodveien 7, N-3194 Horten, Norway;

    SINTEF ICT, Department of Microsystems and Nanotechnology, Oslo, Norway;

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