Research on the bonding of material paths in mem

摘要

Melt extrusion modeling(MEM) is one kind of rapid prototyping technology which is widely used in many areas. The bonding between the material path in MEM is key to prototypes' strength. To analyze the relationship between the bonding strength and the forming parameters easily, bonding potential, a variable measures the bonding interface states, is proposed. The tensile experiments and bonding potential calculations of text samples were done and regress function between bonding potential strength was obtaied. According the bonding potential analysis, this paper has presentedthe forming parameters determining rules.