首页> 外文会议>Proceedings vol.2005-09; European Conference on Chemical Vapor Deposition(EURCVD-15); 20050905-09; Bochum(DE) >STUDY ON THE POSSIBILITIES OF MODELLING THE PHYSICAL PROCESSES INVOLVED IN SPRAY CVD
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STUDY ON THE POSSIBILITIES OF MODELLING THE PHYSICAL PROCESSES INVOLVED IN SPRAY CVD

机译:喷雾化学气相沉积物理过程建模可能性的研究

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摘要

Spray CVD is an attractive CVD technique where thin films can be obtained in a cheap simple way. However, a huge number of deposition parameters are involved, such as: geometrical deposition apparatus parameters, carrier gas flow, substrate temperature, size and distribution droplets, spray angle etc. So, substrate uniform coating requires a detailed knowledge of the spray CVD flow that includes both gas and liquid transfer coupled with heat transfer. This work focuses on the numerical simulation ability to describe these physical processes.
机译:喷雾CVD是一种有吸引力的CVD技术,其中可以以便宜的简单方式获得薄膜。但是,涉及大量沉积参数,例如:几何沉积设备参数,载气流量,基材温度,尺寸和分布液滴,喷涂角度等。因此,基材均匀涂层需要对喷涂CVD流量有详细的了解,包括气体和液体传输以及热传输。这项工作着重于描述这些物理过程的数值模拟能力。

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