DIRECT WAFER BONDING THINNING DOWN A GENERIC TECHNOLOGY TO PERFORM NEW STRUCTURES

摘要

Direct wafer bonding associated to mechanical thinning down is a generic technology enabling the fabrication of new materials and structures. It is perfectly adapted to the transfer of virgin as well as partially or fully processed layers onto different supports. New generation of substrates are thus emerging, to answer to the evolution of requirements in microelectronics and microsystems. Moreover, new stacked structures have been achieved showing integrations of more and more functionalities and illustrating developments of 3D-integration.