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Quality Control of Electroless Copper Plating on the Surface of Graphite Powder

机译:石墨粉表面化学镀铜的质量控制

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The deposition of copper on the surface of graphite powder was made by eletroless copper plating with formaldehyde as reductant, and copper sulfate as main salt. The influencing factors including concentration of copper sulfate solution, the dosage of reductant, the dosage of pH regulator, the dosage of complexing agent and reaction temperature were investigated in the experiment in order to optimize the processing parameter of electroless copper plating on the surface of graphite powder. The micro-topography and composition of graphite power coated with copper were detected by means of scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX). The results showed that the homogeneous rose pink copper coating bonds compactly with the graphite powder at the optimal processing parameters.
机译:通过以甲醛为还原剂,以硫酸铜为主要盐的无电解镀铜来在石墨粉末的表面上沉积铜。实验研究了硫酸铜溶液浓度,还原剂用量,pH调节剂用量,络合剂用量和反应温度等影响因素,以优化石墨表面化学镀铜的工艺参数。粉末。通过扫描电子显微镜(SEM)和能量色散X射线光谱(EDX)来检测涂有铜的石墨粉的微观形貌和组成。结果表明,在最佳工艺参数下,均匀的玫瑰粉红色铜涂层与石墨粉紧密结合。

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