ELECTROLESS COPPER PLATING SOLUTION, METHOD OF CONTROLLING THE SAME, AND ELECTROLESS COPPER PLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electroless copper plating solution which can reduce influences on the human body and environment, and can perform stable and uniform plating for a long time by using a copper plating solution with glyoxylic acid as a reducing agent, to provide a method of controlling the solution, and to provide an electroless copper plating apparatus.;SOLUTION: (1) In the electroless copper plating solution with glyoxylic acid as a reducing agent, and EDTA (ethylenediaminetetraacetic acid) as a complexing agent, there are added a first additive having a solution stabilizing effect, a second additive having a rate controlling effect and a third additive having an effect of reducing the change of the rate even when the concentration of the second additive changes. The method uses the plating solution, and the electroless copper plating apparatus is provided with a glyoxylic acid replenishing means, a copper ion replenishing means, and pH control agent replenishing means. (2) In the electroless copper plating solution with glyoxylic acid as a reducing agent, and a tartrate as a complexing agent, the molar concentration of glyoxylic acid is controlled to ≥8 to the concentration of copper ions, and the concentration of the tartrate is controlled to ≤6 to the concentration of copper ions; the method uses the plating solution; and the electroless copper plating apparatus is provided with a glyoxylic acid replenishing means, a copper ion replenishing means, and a pH control agent replenishing means.;COPYRIGHT: (C)2003,JPO