机译:2,2'-联吡啶对化学镀铜包覆钨复合粉末的镀覆速率,微观结构和性能的影响
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
W-Cu; Electroless plating Cu; 2,2′-Dipyridyl; Plating Cu rate; Microstructure; Performance;
机译:用无电镀由Ag涂覆的Cu粉末制备的W-Cu复合材料的制备和微观结构
机译:TiN纳米粒子对化学镀和粉末冶金制备的W-30Cu复合材料组织和性能的影响
机译:TiB2含量对化学镀和粉末冶金制备的W-30Cu复合材料的组织和性能的影响
机译:pH对化学镀层铜涂层钨复合粉末微观结构和纯度的影响
机译:铝基板的碳化硅/化学镍复合镀层。
机译:化学镀制备高稳定性Pd /陶瓷/ Ti-Al合金复合膜
机译:无用镀镍/阿联器含有无电镀镍夹板的微观结构和导热性