Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly

机译：使用新型用于无铅表面贴装的各向异性导电胶，工艺参数对组件装配和跌落测试性能的影响

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

The novel Anisotropic Conductive Adhesive (ACA) investigated in this research uses a magnetic field to align the conductive particles in the Z-axis direction, during cure, thereby eliminating the need for pressure and the requirement to capture a monolaye

机译：在这项研究中研究的新型各向异性导电胶粘剂（ACA）使用磁场在固化过程中沿Z轴方向排列导电颗粒，从而消除了对压力的需求和捕获单层胶的需求

著录项

来源
《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》||P.225-233|共9页
会议地点 Lake Buena VistaFLUSA
作者
Manian Ramkumar; S.; Srihari; K.;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
adhesives; assembling; materials testing; mechanical testing; surface mount technology; adhesive joint; anisotropic conductive adhesive; component assembly; contact resistance; cure temperature; drop test performance; filler particle; fine particle filler formulatio;

机译：胶粘剂;组装;材料测试;力学性能测试;表面贴装技术;粘接接头;各向异性导电胶;组件装配;接触电阻;固化温度;跌落试验性能;填料颗粒;细颗粒填料配方;

相似文献

外文文献
中文文献
专利

1. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature [J] . Y.C. Chan, D.Y. Luk Microelectronics & Reliability . 2002,第8期

机译：键合参数对柔性倒装芯片封装组件各向异性导电胶互连件可靠性性能的影响I.不同键合温度
2. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure [J] . Y.C. Chan, D.Y. Luk Microelectronics & Reliability . 2002,第8期

机译：键合参数对柔性倒装芯片封装组件各向异性导电胶互连件可靠性性能的影响II。不同的粘合压力
3. A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging [J] . S. Manian Ramkumar, Krishnaswami Srihari Journal of Electronic Packaging . 2007,第2期

机译：一种用于无铅表面贴装电子封装的新型各向异性导电胶
4. Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly [C] . Manian Ramkumar S., Srihari K. Electronic Components and Technology Conference . 2008

机译：使用新型各向异性导电粘合剂对无铅表面安装组件的工艺参数对部件组装和跌落测试性能的影响
5. Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead -free surface mount electronics assembly [D] . Ramkumar, S. Manian 2007

机译：用于无铅表面贴装电子组件的新型各向异性导电胶的工艺分析和性能表征
6. Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive [O] . Tao Xu, Jiayu Chen, Wenhui Yuan, 2018

机译：银纳米线/石墨烯纳米复合材料的自组装合成及其对导电胶性能的影响
7. Influence of Process Parameters on Component Assembly and Drop Test Performance using a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly [O] . S. Manian Ramkumar, Ph. D, K. Srihari 2015

机译：工艺参数对新型各向异性导电胶用于无铅表面贴装组件的元件装配和跌落测试性能的影响
8. Assembly feasibility and reliability studies of surface mount circuit boards manufactured with lead-free solders [R] . Vianco, P. T. , Artaki, I. , Jackson, A. M. , 1994

机译：使用无铅焊料制造的表面贴装电路板的装配可行性和可靠性研究

Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly

摘要

著录项

相似文献

相关主题

期刊订阅