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Power Semiconductor Devices & IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA

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召开地：Lake Buena Vista,FL,USA
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1.C4NP technology: Manufacturability, yields and reliability

机译：C4NP技术：可制造性，良率和可靠性
- 作者：Perfecto;E.D.;Hawken;D.;Longworth;H.P.;Cox;H.;Srivastava;K.;Oberson;V.;Shah;J.;Garant;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
2.Reliability issues on the high speed DRAM flip-chip package using gold stud bump, lead free solder, and underfill

机译：使用金柱形凸点，无铅焊料和底部填充的高速DRAM倒装芯片封装的可靠性问题
- 作者：Woong Sun Lee;Myoung Geun Park;Il Whan Cho;Sung Chul Kim;Ki Young Kim;Qwan Ho Chung;Kwang Yoo Byun
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
3.Synthesizing SPICE-compatible models of power delivery networks with resonance effect by time-domain waveforms

机译：通过时域波形合成具有谐振效应的输电网络兼容SPICE的模型
- 作者：Chen-Chao Wang;Chih-Wen Kuo;Hung-Hsiang Cheng;Chiu;C.T.;Hung;C.P.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
4.The effect of pcb flexural modes on dynamic reliability of ball grid array packages

机译：pcb弯曲模式对球栅阵列封装动态可靠性的影响
- 作者：Towashiraporn;P.;Crosbie;P.;Lee;Y.J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
5.Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate

机译：X射线衍射法测量合金42基体上电沉积SnCu涂层的应力
- 作者：Kato;T.;Akahoshi;H.;Nakamura;M.;Hashimoto;T.;Nishimura;A.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
6.Multichip self-assembly technique on flexible polymeric substrate

机译：柔性聚合物基板上的多芯片自组装技术
- 作者：Fukushima;T.;Konno;T.;Tanaka;T.;Koyanagi;M.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- large scale integration;
- micromechanical devices;
- self-assembly;
- LSI;
- MEMS;
- batch processes;
- flexible polymeric substrate;
- multichip self-assembly;
7.Die attach adhesives for 3D same-sized dies stacked packages

机译：用于3D相同尺寸裸片堆叠封装的裸片附着粘合剂
- 作者：Ch;T.;Gaurav;M.;Tan Hua Hong;Pl;O.W.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- adhesives;
- elemental semiconductors;
- microassembling;
- silicon;
- 3D same-sized dies stacked packages;
- adhesives;
- assembly;
- die attach;
- dummy silicon-as-spacer;
- film-as spacer;
- paste-as-spacer;
8.Validation of warpage for small form factor flip-chip BGA by experimental and numerical methodology

机译：通过实验和数值方法验证小尺寸倒装芯片BGA的翘曲
- 作者：Tsrong-Yi Wen;Shih-Chang Ku
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
9.Fracture mechanics study of fatigue crack growth in solder joints under drop impact

机译：跌落冲击下焊点疲劳裂纹扩展的断裂力学研究
- 作者：Jason Wang;Seah;S.K.W.;Wong;E.H.;Cadge;D.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- bending;
- fatigue cracks;
- fracture mechanics;
- impact (mechanical);
- materials testing;
- solders;
- J-integral;
- crack growth rate;
- drop impact;
- fatigue crack growth;
- fracture mechanics;
- high speed cyclic bending;
- solder joints;
10.Finite element based three dimensional crack propagation simulation on interfaces in electronic packages

机译：基于有限元的电子封装界面三维裂纹扩展模拟
- 作者：Ozkan;U.;Nied;H.F.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
11.Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

机译：独立的聚对二甲苯密封铜互连，用于可拉伸的硅电子产品
- 作者：Sosin;S.;Zoumpoulidis;T.;Bartek;M.;Wang;L.;Dekker;R.;Jansen;K.M.B.;Ernst;L.J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
12.Mechanical reliability modeling and characterization for Package-on-Package

机译：叠层包装的机械可靠性建模和表征
- 作者：Amagai;M.;Suzuki;Y.;Abe;K.;Young Bae Kim;Sano;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
13.Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

机译：包装设计和材料对温度循环，弯曲和跌落载荷条件下可靠性的影响
- 作者：Syed;A.;Scanlan;J.;Se Woong Cha;Won Joon Kang;Eun Sook Sohn;Tae Seong Kim;Chang Gyun Ryu
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
14.Chip package interaction evaluation for a high performance 65nm and 45nm CMOS Technology in a stacked die package with C4 and wirebond interconnections

机译：具有C4和引线键合互连的堆叠式芯片封装中的高性能65nm和45nm CMOS技术的芯片封装相互作用评估
- 作者：Muzzy;C.;Danovitch;D.;Gagnon;H.;Hannon;R.;Kinser;E.;McLaughlin;P.V.;Mongeau;G.;Quintal;J.-G.;Sylvestre;J.;Turcotte;E.;Wright;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
15.Multi-walled carbon nanotubeanocrystalline copper nanocomposite film as an interconnect material

机译：多壁碳纳米管/纳米铜纳米复合膜作为互连材料
- 作者：Jung Joon Yoo;Jae Yong Song;Jin Yu;Ho Ki Lyeo;Sungjun Lee;Jun Hee Hahn
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
16.Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

机译：具有各向异性导电胶（ACA）接头的超薄挠性芯片（UTCOF）的可靠性
- 作者：Su-Tsai Lu;Wen-Hwa Chen
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
17.A novel mask-less method of fabricating high aspect ratio microneedles for blood sampling

机译：一种新颖的无掩膜的高纵横比微针制造方法
- 作者：Bhandari;R.;Negi;S.;Solzbacher;F.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- biological tissues;
- blood;
- etching;
- laser beam machining;
- micromechanical devices;
- needles;
- patient treatment;
- batch fabrication;
- blood sampling;
- dicing;
- insertion pain;
- laser machining;
- mask-less method;
- microneedle array;
- microsystem;
- tissue trauma;
- wet etching;
18.Optimization of a microfluidic cartridge for Lab-on-a-chip (LOC) application and bio-testing for DNA/RNA extraction

机译：用于芯片实验室（LOC）应用的微流控盒的优化以及DNA / RNA提取的生物测试
- 作者：Ling Xie;Premachandran;C.S.;Chew;M.;Ser Choong Chong;Leong Ching Wai;Lau;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
19.Application of through mold via (TMV) as PoP base package

机译：通模过孔（TMV）作为PoP基础封装的应用
- 作者：Jinseong Kim;Kiwook Lee;Dongjoo Park;Taekyung Hwang;Kwangho Kim;Daebyoung Kang;Jaedong Kim;Choonheung Lee;Scanlan;C.;Berry;C.J.;Zwenger;C.;Smith;L.;Dreiza;M.;Darveaux;R.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
20.A dual face package using a post with wire component: Novel structure for PoP, wafer level CSP and compact image sensor packages

机译：使用带有导线组件的接线柱的双面封装：用于PoP，晶圆级CSP和紧凑型图像传感器封装的新型结构
- 作者：Ishihara;M.;Takehara;Y.;Yano;T.;Ino;Y.;Kurogi;T.;Hashimoto;K.;Kawano;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
21.Selective one-step plasma patterning process for fluidic self-assembly of silicon chips

机译：硅芯片流体自组装的选择性一步等离子体图案化工艺
- 作者：Bock;K.;Scherbaum;S.;Yacoub-George;E.;Landesberger;C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- conductive adhesives;
- contact angle;
- copper;
- elemental semiconductors;
- fluidics;
- foils;
- metallic thin films;
- microassembling;
- monolithic integrated circuits;
- plasma materials processing;
- polymers;
- self-assembly;
- silicon;
- surface energy;
- surface treatment;
- wetting;
- aniso;
22.Implementation of a mobile phone module with redistributed chip packaging

机译：带重新分配芯片封装的手机模块的实现
- 作者：Ramanathan;L.N.;Keser;B.;Amrine;C.;Trung Duong;Hayes;S.;Leal;G.;Mangrum;M.;Mitchell;D.;Wenzel;R.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
23.The viability of 25 Gb/s on-board signalling

机译：25 Gb / s板载信令的可行性
- 作者：Ritter;M.B.;Pepeljugoski;P.;Xiaoxiong Gu;Young Kwark;Dong Kam;Rimolo-Donadio;R.;Boping Wu;Baks;C.;John;R.;Lei Shan;Schuster;C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
24.Evaluation of high density liquid crystal polymer based flex interconnect for supporting greater than 1 TB/s of memory bandwidth

机译：用于支持大于1 TB / s的存储带宽的基于高密度液晶聚合物的柔性互连的评估
- 作者：Kollipara;R.;Ming Li;Chuck Yuan;Kusamitsu;H.;Ito;T.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
25.Analysis of copper treatments and the effects on signal propagation

机译：分析铜处理及其对信号传播的影响
- 作者：Pytel;S.G.;Huray;P.G.;Hall;S.H.;Mellitz;R.I.;Brist;G.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
26.A study of crack propagation in Pb-free solder joints under drop impact

机译：跌落冲击下无铅焊点裂纹扩展的研究
- 作者：Caers;J.F.J.;Wong;E.H.;Seah;S.K.W.;Zhao;X.J.;Selvanayagam;C.S.;van Driel;W.D.;Owens;N.;Leoni;M.;Tan;L.C.;Eu;P.L.;Yi-Shao Lai;Chang-Lin Yeh
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- ball grid arrays;
- cracks;
- impact testing;
- soldering;
- solders;
- BGA assembly;
- ENIG;
- OSP;
- SAC101;
- SAC305;
- crack propagation;
- cross-section;
- drop impact;
- drop testing;
- ductile solder material;
- dye-and-pry method;
- electrical FE simulation;
- failure analysis;
- high speed bend tes;
27.An alternative solder interconnect reliability test to evaluate drop impact performance

机译：另一种焊料互连可靠性测试，用于评估跌落冲击性能
- 作者：Zaal;J.J.M.;Hochstenbach;H.P.;van Driel;W.D.;Zhang;G.Q.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
28.Robust design of third level packaging in portable electronics: Solder joint reliability under dynamic mechanical loading

机译：便携式电子产品中三级包装的稳健设计：动态机械载荷下的焊点可靠性
- 作者：Canumalla;S.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
29.Integration of high aspect ratio tapered silicon via for through-silicon interconnection

机译：高纵横比锥形硅通孔的集成，用于硅互连
- 作者：Ranganathan;N.;Liao Ebin;Linn Linn;Lee;W.S.V.;Navas;O.K.;Kripesh;V.;Balasubramanian;N.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
30.Assessment of PCB pad cratering resistance by joint level testing

机译：通过接缝水平测试评估PCB焊盘的抗缩孔性
- 作者：Roggeman;B.;Borgesen;P.;Jing Li;Godbole;G.;Tumne;P.;Srihari;K.;Levo;T.;Pitarresi;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
31.Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads

机译：询问系统状态以评估受热机械负荷的无铅电子产品的损坏
- 作者：Lall;P.;Bhat;C.;Hande;M.;More;V.;Vaidya;R.;Pandher;R.;Suhling;J.;Goebel;K.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
32.Green dielectric implementation in RF modules

机译：射频模块中的绿色介电实现
- 作者：Petty-Weeks;S.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
33.A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

机译：夹式硅通孔（TSV）互连，用于使用焊盘上的金属帽和在通孔中形成金属柱的堆叠芯片键合
- 作者：Li-Cheng Shen;Chien-Wei Chien;Jin-Ye Jaung;Yin-Po Hung;Wei-Chung Lo;Chao-Kai Hsu;Yuan-Chang Lee;Hsien-Chie Cheng;Chia-Te Lin
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
34.High aspect ratio TSV copper filling with different seed layers

机译：高深宽比TSV铜填充不同的种子层
- 作者：Wolf;M.J.;Dretschkow;T.;Wunderle;B.;Jurgensen;N.;Engelmann;G.;Ehrmann;O.;Uhlig;A.;Michel;B.;Reichl;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
35.Through silicon via copper electrodeposition for 3D integration

机译：通过硅过孔铜电沉积进行3D集成
- 作者：Beica;R.;Sharbono;C.;Ritzdorf;T.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
36.Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies

机译：区域阵列组件中全面热机械变形分析的现代测试方法
- 作者：Pustan;D.;Wilde;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
37.Simultaneous measurements of effective chemical shrinkage and modulus evolution during polymerization

机译：聚合过程中有效化学收缩率和模量演变的同时测量
- 作者：Yong Wang;Bongtae Han;Bar-Cohen;A.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- Bragg gratings;
- curing;
- elastic moduli;
- fibre optic sensors;
- internal stresses;
- polymerisation;
- polymers;
- shrinkage;
- Bragg wavelength shift;
- FBG;
- chemical shrinkage;
- curing;
- fiber Bragg grating sensor;
- geometrically-complex packaged assemblies;
- modulus;
- polymer;
- polymer;
38.Characterization and modeling of non-linear inelastic behavior of organic packages at component and system levels

机译：在组件和系统级别对有机包装的非线性非弹性行为进行表征和建模
- 作者：Tieyu Zheng;Min Tao;Nardi;P.;Modi;M.;Sane;S.;Bekar;I.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
39.A light emitting diode s chip structure with low stress and high light extraction efficiency

机译：低应力高光提取效率的发光二极管芯片结构
- 作者：Liuxi Tan;Jia Li;Zongyuan Liu;Kai Wang;Pei Wang;Zhiying Gan;Sheng Liu
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
40.Novel wafer-level CSP for stacked MEMS / IC dies with hermetic sealing

机译：具有气密密封的新型MEMS / IC堆叠晶片级CSP
- 作者：Sugizaki;Y.;Nakao;M.;Higuchi;K.;Miyagi;T.;Obata;S.;Inoue;M.;Endo;M.;Shimooka;Y.;Kojima;A.;Mori;I.;Shibata;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
41.Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

机译：适用于堆叠式MEMS / IC封装的稳健的密封晶圆级薄膜封装技术
- 作者：Shimooka;Y.;Inoue;M.;Endo;M.;Obata;S.;Kojima;A.;Miyagi;T.;Sugizaki;Y.;Mori;I.;Shibata;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
42.Influence of optical probe packaging on a 3D MEMS scanning micro-mirror for optical coherence tomography (OCT) applications

机译：光学探针封装对用于光学相干断层扫描（OCT）应用的3D MEMS扫描微镜的影响
- 作者：Premachandran;C.S.;Khairyanto;A.;Chen;K.;Singh;J.;Sandy Xl Wang;Xu Yingshun;Chen Nanguang;Sheppard;C.J.R.;Olivo;M.;Lau;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
43.High temperature alternatives to ball grid coplanarity measurements to improve correlation to surface mount quality

机译：球栅共面性测量的高温替代品，以改善与表面贴装质量的相关性
- 作者：Gamer;L.;Raghavan;P.;Noolu;N.;Sanchez;J.;Yung Hsiang Lee
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
44.Copper/carbon nanotube composite interconnect for enhanced electromigration resistance

机译：铜/碳纳米管复合互连件，可增强抗电迁移性
- 作者：Yang Chai;Chan;P.C.H.;Yunyi Fu;Chuang;Y.C.;Liu;C.Y.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
45.Dendritic palladium-silver nano-structure grown by electrochemical migration method for hydrogen sensing device

机译：电化学迁移法制备氢感测器件的树枝状钯银纳米结构
- 作者：Shin-Bok Lee;Eunsongyi Lee;Wooyoung Lee;Young-Chang Joo
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
46.Laser processing of 3-D structures for embedded and integrated components: An application of flexible and printable nanomaterials in microelectronics

机译：嵌入式和集成部件的3-D结构的激光加工：柔性和可印刷纳米材料在微电子学中的应用
- 作者：Das;R.N.;Egitto;F.D.;Antesberger;T.E.;Marconi;F.;How Lin;Lauffer;J.M.;Markovich;V.R.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
47.The superior drop test performance of SAC-Ti solders and its mechanism

机译：SAC-Ti焊料优异的跌落测试性能及其机理
- 作者：Weiping Liu;Bachorik;P.;Ning-Cheng Lee
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- solders;
- titanium alloys;
- IMC layer;
- SAC-Ti alloys;
- SAC-Ti solders;
- Ti;
- superior drop test;
- surface finish systems;
- thermal fatigue performance;
- SAC;
- Solder;
- drop test;
- fragility;
- lead-free;
- tin-silver-copper;
48.A new mechanism for Hillock formation over electrodeposited thin tin film

机译：在电镀锡薄膜上形成Hillock的新机理
- 作者：Jing Cheng;Chen;S.;Vianco;P.;Li;J.C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
49.Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

机译：Sn-Ag焊料中添加Al对与Cu和ENIG金属化的界面反应的影响
- 作者：Young-Kun Jee;Yang-hua Xia;Jin Yu;Hyun-Woo Kang;Taek-Young Lee
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- ageing;
- aluminium;
- association;
- reflow soldering;
- silver alloys;
- tin alloys;
- voids (solid);
- Al;
- ENIG metallization;
- Kirkendall voids formation;
- Sn-Ag;
- aging;
- interfacial microstructures;
- interfacial reactions;
- intermetallic compounds;
- metal pads;
- reflow solder;
- solder jo;
50.Pushing the limits of PCI-express: A PCIe application within an IBM supercomputing environment

机译：突破PCI-express的极限：IBM超级计算环境中的PCIe应用程序
- 作者：Germann;P.;Doyle;M.;Ericson;R.;Lewis;S.;Dangler;J.;Patel;A.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
51.Optimizing the mobile platform for energy efficiency

机译：优化移动平台的能源效率
- 作者：Rahal-Arabi;T.;Hee-Jun Park
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
52.Novel bus termination schemes to reduce IO power consumption on low power intel small form factor platforms

机译：新颖的总线端接方案可减少低功耗英特尔小型平台上的IO功耗
- 作者：Das;R.;Iyer;J.;Suchitha;V.;Praveen K;Y.;Minh Ti Tran;Thomas;S.A.;Gupta;S.K.;Kraipak;W.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
53.Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing

机译：退火和电流应力作用下铜柱凸块中的金属间化合物和柯肯达尔空穴生长
- 作者：Byoung-Joon Kim;Gi-Tae Lim;Jaedong Kim;Kiwook Lee;Young-Bae Park;Young-Chang Joo
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
54.Impact of system level thermal solution on the interconnect reliability of high performance and high heat dissipating CSP package

机译：系统级散热解决方案对高性能和高散热CSP封装互连可靠性的影响
- 作者：Ahmad;M.;Liu;K.C.;Lee;C.J.;Priest;J.;Sung-Ju Pak;Narasimhan;S.;Nagar;M.;Jie Xue
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
55.A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design

机译：用于优化空隙消除设计的模制底部填充剂（MUF）的流变性和流动模型的研究
- 作者：Min Woo Lee;Woon Kab Jung;Eun Sook Sohn;Joon Yeob Lee;Chan Ha Hwang;Choon Heung Lee
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
56.Effect of joint size and pad metallization on solder mechanical properties

机译：焊点尺寸和焊盘金属化对焊料机械性能的影响
- 作者：Darveaux;R.;Reichman;C.;Berry;C.J.;Wen-Sung Hsu;Syed;A.;Chang Woo Kim;Jung Hun Ri;Tae Seong Kim
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- brittleness;
- copper;
- copper alloys;
- creep;
- fatigue;
- finite element analysis;
- gold alloys;
- indium alloys;
- lead alloys;
- mechanical testing;
- metallisation;
- metallurgy;
- nickel alloys;
- silver alloys;
- solders;
- tin alloys;
- Cu;
- In;
- NiAu;
- NiSn;
- SnAg;
- SnAgCu;
- SnPbAg;
- brittle interface f;
57.Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

机译：多层陶瓷基板上的多芯片集成大功率白光LED器件
- 作者：Luqiao Yin;Weiqiao Yang;Yansheng Guo;Kejun Ma;Shuzhi Li;Mingfa Chen;Jia Li;Jianhua Zhang
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
58.Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package

机译：高亮度发光二极管（HBLED）封装的传热和机械可靠性的设计优化
- 作者：Shan Gao;Jupyo Hong;Sanghyun Shin;Yongki Lee;Seogmoon Choi;Sung Yi
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
59.An efficient method for power integrity and EMI Analysis of advanced packages

机译：一种高级封装的电源完整性和EMI分析的有效方法
- 作者：En-Xiao Liu;Xingchang Wei;Zaw Zaw Oo;Er-Ping Li
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
60.Controllable parameters identification for high speed channel through signal-power integrity combined analysis

机译：通过信号-功率完整性组合分析确定高速通道的可控参数
- 作者：Myoung Joon Choi;Pandit;V.S.;Woong Hwan Ryu
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
61.Bit-pattern optimization for accurate analysis of complex high-speed interfaces

机译：位模式优化可精确分析复杂的高速接口
- 作者：Singh;N.;Mutnury;B.;Pham;N.;Cases;M.;Wesley;C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
62.Comparison and analysis of integrated passive device technologies for wireless radio frequency module

机译：无线射频模块集成无源器件技术的比较与分析
- 作者：Kundu;A.C.;Megahed;M.;Schmidt;D.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
63.Highly reliable multi stripe laser diodes

机译：高度可靠的多条纹激光二极管
- 作者：Wolak;E.;Kuppuswamy;K.;Harrison;J.;Xu Jin;Hanxuan Li;Fidric;B.;Miller;R.;Cross;P.;Towe;T.;Truchan;T.;Hoa Nguyen;Edirisinghe;C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
64.Finite element modeling and experimental validation of conventional and high speed shear testing in Pb-free environment

机译：无铅环境中常规和高速剪切测试的有限元建模和实验验证
- 作者：Ajmera;A.;Ramkumar;S.M.;Ti Lin Liu
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
65.Nanostructured polymer-metal composite for thermal interface material applications

机译：用于热界面材料的纳米结构聚合物-金属复合材料
- 作者：Carlberg;B.;Teng Wang;Yifeng Fu;Liu;J.;Dongkai Shangguan
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
66.Using novel materials to enhance the efficiency of conductive polymer

机译：使用新型材料提高导电聚合物的效率
- 作者：Cheng Yang;Yuen;M.M.F.;Bing Xu
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
67.Packaging the Cell Broadband Engine microprocessor for supercomputer applications

机译：打包用于超级计算机应用的单元宽带引擎微处理器
- 作者：Harvey;P.;Mandrekar;R.;Zhou;Y.;Zheng;J.;Maloney;J.;Cain;S.;Kawasaki;K.;Lafontant;G.;Noma;H.;Imming;K.;Plachy;T.;Questad;D.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
68.High speed digital signal analysis of ultra-broadband micromachined flip-chip interconnect designs

机译：超宽带微机械倒装芯片互连设计的高速数字信号分析
- 作者：Young Seek Cho;Drayton;R.F.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
69.Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects

机译：新型碳纳米管非导电粘合剂/薄膜，用于高性能互连
- 作者：Hongjin Jiang;Myung Jin Yim;Kyoung-sik Moon;Wong;C.P.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
70.Carbon nanotube bumps for LSI interconnect

机译：用于LSI互连的碳纳米管凸块
- 作者：Soga;I.;Kondo;D.;Yamaguchi;Y.;Iwai;T.;Mizukoshi;M.;Awano;Y.;Yube;K.;Fujii;T.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
71.Study of the mechanisms of spectral broadening in high power semiconductor laser arrays

机译：大功率半导体激光器阵列光谱展宽机理的研究
- 作者：Xingsheng Liu;Jingwei Wang;Peiyong Wei
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
72.Cooling approaches for high power diode laser bars

机译：大功率二极管激光棒的冷却方法
- 作者：Leers;M.;Boucke;K.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
73.Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies

机译：翘曲对凸块疲劳可靠性的影响：实验和分析研究
- 作者：Wei Tan;Ume;I.C.;Ying Hung;Wu;C.F.J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
74.An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

机译：热循环下无铅（SAC）焊点可靠性的加速模型
- 作者：Vasudevan;V.;Xuejun Fan
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
75.LC-based WiFi and WiMAX Baluns embedded in a multilayer organic flip-chip ball grid array (FCBGA) package substrate

机译：嵌入多层有机倒装芯片球栅阵列（FCBGA）封装基板中的基于LC的WiFi和WiMAX Baluns
- 作者：Davies-Venn;E.;Kamgaing;T.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
76.Evaluation of new substrate surface finish: Electroless nickel/electroless palladium/immersion gold (ENEPIG)

机译：评估新的基板表面光洁度：化学镍/化学钯/浸金（ENEPIG）
- 作者：Chun-Hsien Fu;Liang-Yi Hung;Don-Son Jiang;Chiang-Cheng Chang;Wang;Y.P.;Hsiao;C.S.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
77.Fabrication and assembly of high gain MEMS antennas for wireless communications

机译：用于无线通信的高增益MEMS天线的制造和组装
- 作者：Wang;C.H.;Pavuluri;S.K.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
78.Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique

机译：通过低温晶圆到晶圆键合技术将RF-MEMS，无源器件和CMOS-IC集成在硅基板上
- 作者：Zhang;Q.X.;Li;H.Y.;Tang;M.;Yu;A.B.;Liao;E.B.;Rong Yang;Lo;G.Q.;Balasubramanian;N.;Kwong;D.L.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- CMOS integrated circuits;
- Q-factor;
- elemental semiconductors;
- micromechanical devices;
- passive networks;
- silicon;
- wafer bonding;
- CMOS-IC;
- Cu damascene process;
- Q-factor;
- RF-MEMS;
- Si;
- inductor;
- passives;
- silicon substrate;
- wafer bonding;
79.Low stress and high thermal conductive underfill for cu/low-k application

机译：适用于cu / low-k应用的低应力和高导热性底部填充剂
- 作者：Qizhen Liang;Kyoung-Sik Moon;Yuelan Zhang;Wong;C.P.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- adhesion;
- copper;
- filled polymers;
- high-temperature effects;
- integrated circuit interconnections;
- nanostructured materials;
- oxidation;
- silicon compounds;
- thermal analysis;
- thermal conductivity;
- thermal resistance;
- transmission electron microscopy;
- Cu;
- DMA;
- TEM;
- TGA;
- cop;
80.Nano-micro filled conductive adhesive based 3D micro arrays for Z-axis interconnections

机译：用于Z轴互连的基于纳米微填充导电胶的3D微阵列
- 作者：Das;R.N.;Lauffer;J.M.;Poliks;M.D.;Egitto;F.D.;Markovich;V.R.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
81.Novel flip-chip interconnection technology for millimeter wave applications

机译：适用于毫米波应用的新型倒装芯片互连技术
- 作者：Felbier;F.;Draheim;F.;Goebel;U.;Karstensen;H.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
82.Optimizing Au and In micro-bumping for 3D chip stacking

机译：优化用于3D芯片堆叠的Au和In微凸点
- 作者：Zhang;W.;Matin;A.;Beyne;E.;Ruythooren;W.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- chemical interdiffusion;
- diffusion barriers;
- diffusion bonding;
- flip-chip devices;
- gold;
- indium;
- integrated circuit bonding;
- metallic thin films;
- reaction kinetics;
- shear strength;
- soldering;
- titanium;
- 3D chip stacking technology;
- Au-In;
- Au-Ti-In;
- diffusion barrier;
- dif;
83.Influence of filler settling on the analysis of solder reliability of flip chip packaging

机译：填料沉降对倒装芯片焊接可靠性分析的影响
- 作者：Cheng-fu Chen;Karulkar;P.C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
84.Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies

机译：商用光电组件对陶瓷表面的环氧粘合强度
- 作者：Williams;O.;Liu;C.;Webb;D.P.;Firth;P.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
85.Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer

机译：使用可自图案化的金属纳米粒子作为粘结层的低温，细间距互连
- 作者：Mehrotra;G.;Jha;G.;Goud;J.D.;Raj;P.M.;Venkatesan;M.;Iyer;M.;Hess;D.;Tummala;R.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- copper;
- diffusion;
- fine-pitch technology;
- gold;
- microassembling;
- surface energy;
- wafer bonding;
- wetting;
- Au;
- Cu;
- accelerated diffusion kinetics;
- bonding layer;
- fine pitch bonding;
- fine-pitch interconnections;
- selective wetting;
- self-patternable metallic nanoparticles;
- s;
86.Embedded capacitor technology: A real world example

机译：嵌入式电容器技术：一个真实的例子
- 作者：Smith;N.;Jun Fan;Andresakis;J.;Fukawa;Y.;Harvey;M.;Knighten;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
87.Underfill fracture toughness as a function of cooling rate

机译：底部填充断裂韧性与冷却速率的关系
- 作者：Soojae Park;Feger;C.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
88.Design and fabrication of integrated solenoid inductors with magnetic cores

机译：带磁芯的集成螺线管电感器的设计与制造
- 作者：Lee;D.W.;Kyu-Pyung Hwang;Wang;S.X.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
89.Active optical links embedded in flexible substrates

机译：嵌入柔性基板中的有源光链路
- 作者：Bosman;E.;Van Steenberge;G.;Christiaens;W.;Hendrickx;N.;Vanfleteren;J.;Van Daele;P.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
90.3D packaging architecture using paper as a dielectric medium

机译：使用纸作为电介质的3D包装架构
- 作者：Rida;A.;Li Yang;Chaisilwattana;N.;Travis;S.;Bhattacharya;S.;Tentzeris;M.M.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
91.Reliability testing of through-silicon vias for high-current 3D applications

机译：用于大电流3D应用的硅通孔的可靠性测试
- 作者：Wright;S.L.;Andry;P.S.;Sprogis;E.;Dang;B.;Polastre;R.J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
92.A new method for equivalent acceleration of JEDEC moisture sensitivity levels

机译：等效加速JEDEC湿度敏感性水平的新方法
- 作者：Daniel Shi;Xuejun Fan;Bin Xie
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
93.Electrodeposition of indium for bump bonding

机译：电镀铟以进行凸点焊接
- 作者：Yingtao Tian;Changqing Liu;Hutt;D.;Stevens;B.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
- electrodeposits;
- electrolytes;
- electroplating;
- grain size;
- indium;
- metallisation;
- photoresists;
- ultrasonic effects;
- vibrations;
- wetting;
- In;
- bump bonding;
- bump metallization;
- current distribution;
- electrodeposition;
- electrolyte;
- electroplating;
- evaporation;
- grain size;
- hig;
94.Reliability of wafer level chip scale packages (WL-CSP) under dynamic loadings

机译：动态负载下晶圆级芯片规模封装（WL-CSP）的可靠性
- 作者：Lee;Y.J.;Crosbie;P.;Brown;M.;Zbrzezny;A.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
95.Validation of warpage limit for successful component surface mount (SMT)

机译：验证翘曲极限以成功地进行表面贴装（SMT）
- 作者：Cho;S.;Amir;D.;Reichman;A.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
96.An integrated passive balun on Si, SiGe, and GaAs substrates

机译：Si，SiGe和GaAs衬底上的集成无源巴伦
- 作者：Li Li;Keyvani;D.;Jangsup Yoon;Bhan;V.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
97.Novel low-cost on-chip CPW slow-wave structure for compact RF components and mm-wave applications

机译：新型低成本片上CPW慢波结构，适用于紧凑的RF组件和毫米波应用
- 作者：Guoan Wang;Woods;W.;Hanyi Ding;Mina;E.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
98.A self-aligning latch-up mechanism in out of plane silicon microelectrode array for neural prosthesis

机译：面外硅微电极阵列中用于神经假体的自对准闩锁机制
- 作者：Negi;S.;Bhandari;R.;Solzbacher;F.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
99.Process development and reliability evaluation for inline Package-on-Package (pop) assembly

机译：内联包装（pop）组装的工艺开发和可靠性评估
- 作者：Sjoberg;J.;Geiger;D.A.;Dongkai Shangguan
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》
100.Reliability of flip chip packages with high thermal conductivity heat spreader attach

机译：具有高导热率散热器盖的倒装芯片封装的可靠性
- 作者：Yuquan Li;Johnson;R.W.;Thompson;P.;Hooghan;T.;Libres;J.
- 会议名称：《Power Semiconductor Devices amp; IC's, 2005 IEEE International Symposium on; Lake Buena Vista,FL,USA》