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Qualification of design-optimized multi-zone hotplate for 45nm node mask making

机译:用于45nm节点掩模制作的设计优化的多区域加热板的资格鉴定

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摘要

The demand for ever smaller features in integrated circuit manufacturing continues to put more stringent requirements on photomask fabrication, particularly with respect to critical dimension (CD) control. A high resolution process for making attenuated-phase-shift masks (attPSM) for the 45nm node with a negative-tone chemically amplified resist (nCAR), utilizing a new precision bake system, was evaluated. This process showed a significant performance improvement in critical dimension uniformity (CDU), respective to an established process based on an APB55OO system. A CD-uniformity improvement from 2.1nm CD 3σ to 1.3nm CD 3σ (40%) was achieved on a demanding layout. The new precision bake system utilizes an improved multi-zone hotplate design and control algorithm, which enables highly precise temperature controllability, facilitating a superior temperature ramp-up performance, as well as significantly improved temperature setpoint stability, as has been measured with a 25-point sensor mask for a 95°C bake process. The new precision bake system shall now be introduced to the market within the HamaTech MaskTrack series.
机译:对集成电路制造中越来越小的特征的需求继续对光掩模制造提出了更严格的要求,特别是在临界尺寸(CD)控制方面。评估了一种高分辨率工艺,该工艺利用新型精密烘烤系统为具有负性化学放大抗蚀剂(nCAR)的45nm节点制作了衰减相移掩模(attPSM)。与基于APB55OO系统的既定过程相比,该过程在临界尺寸均匀度(CDU)方面显示出显着的性能改进。在要求苛刻的布局上,将CD均匀性从2.1nm CD3σ提高到1.3nm CD3σ(40%)。新的精密烘烤系统利用改进的多区域加热板设计和控制算法,可实现高精度的温度可控制性,促进卓越的温度上升性能,并显着提高了温度设定值的稳定性(如使用25-点传感器掩模,用于95°C的烘烤过程。现在,新的精密烘烤系统将在HamaTech MaskTrack系列中推向市场。

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