RELIABILITY OF ADHESIVE BOND JOINTS IN ELECTRONICS PACKAGING

摘要

A common requirement in electronic packaging is the verification of the reliability of an adhesively bonded joint. Adhesives are used to bond relatively small active and inactive devices as well as large area components. Finite element analysis has been used extensively in an attempt to determine the stress state in the bonded joint for comparison with critical strength values of the adhesive. The necessity for a very fine element mesh and the requirement to control element aspect ratios makes this a difficult challenge for h-code programs. A comparison of stress results will be presented for a single lap shear specimen using both h- and p- extension methods. The stress results from the lap shear specimen will be used to predict the failure load for a die shear specimen by use of an equivalent damage zone concept. It is also well known that a stress singularity of the form A_ir~(α_i-1) exists at the interface of two adjacent materials on the free surface. The use of these parameters, as a failure criterion will be discussed.