CIRCUIT BOARD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME TO IMPROVE BONDING RELIABILITY OF SOLDER JOINT

摘要

Purpose a: even if deviation occurs to increase by a wetted area in stack package and by the flux relative to a soldered ball, for manufacturing a circuit board of semiconductor encapsulation by making adjust automatically be arranged to improve the bonding reliability of a soldered fitting as caused by a step structure of a ball land part. Construction: a resin layer (1) forms a core. One conductive A metal trace (2) forms a predetermined pattern on the resin layer. The ball land part (200) that one solder mask (3) is formed in only metal trace is opened, the mode that the upper surface of the resin layer in addition to ball land part is covered by solder mask. One step part is formed in the side wall of ball land part.