Self-alignment by flip-chip bonding for OE-MCM packaging

摘要

Abstract: The impact of process variation associated with lateral and axial misalignment of flip-chip solder joint based assembly for OE-MCM packaging is analyzed through quasi-static force balance in the system. The effect of variation in solder deposition height, vertical loading, and surface tension coefficient on the alignment, and therefore on the optical performance of the system, is studied. !12