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Manufacturing cost analysis of integrated photonic packages

机译:集成光子封装的制造成本分析

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Abstract: This paper analyzes the manufacturing cost of photonic system using software that combines several methods for accurate cost accounting. Activity based costing assigns al capital equipment, material and labor costs directly to the product rather than to overheads. Cost of ownership models determine the cost of using machines under different financial and utilization scenarios. Libraries of standard machines, process steps, and process sequences facilitate rapid model building and modification. Using libraries for semiconductor and photonics fabrication, along with packaging and optomechanical assembly, we construct cost models for 2D VCSEL array communication modules. The result of the analysis is that the model cost is driven mainly by the epitaxial material cost, and laser yield limits VCSEL arrays to small scale integration. !8
机译:摘要:本文使用结合多种方法进行准确成本核算的软件来分析光子系统的制造成本。基于活动的成本核算将资本设备,材料和人工成本直接分配给产品,而不是间接费用。拥有成本模型确定了在不同财务和使用情况下使用机器的成本。标准机器,处理步骤和处理序列的库有助于快速建立和修改模型。使用用于半导体和光子学制造的库,以及封装和光机械组装,我们为2D VCSEL阵列通信模块构建成本模型。分析的结果是,模型成本主要由外延材料成本驱动,而激光成品率将VCSEL阵列限制为小规模集成。 !8

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