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Manufacturing cost analysis of integrated photonic packages

机译:集成光子封装的制造成本分析

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This paper analyzes the manufacturing cost of photonic system using software that combines several methods for accurate cost accounting. Activity based costing assigns al capital equipment, material and labor costs directly to the product rather than to overheads. Cost of ownership models determine the cost of using machines under different financial and utilization scenarios. Libraries of standard machines, process steps, and process sequences facilitate rapid model building and modification. Using libraries for semiconductor and photonics fabrication, along with packaging and optomechanical assembly, we construct cost models for 2D VCSEL array communication modules. The result of the analysis is that the model cost is driven mainly by the epitaxial material cost, and laser yield limits VCSEL arrays to small scale integration.
机译:本文使用若干方法进行准确成本核算的软件分析光子系统的制造成本。基于活动的成本为代表Al Capital Equipment,Mathess和劳动力成本直接向产品而不是开销。所有权模型的成本决定了在不同的财务和利用方案下使用机器的成本。标准机器,工艺步骤和过程序列的图书馆有助于快速模型建设和修改。使用用于半导体和光子学制造的文库,以及包装和光学机械组件,我们构造了2D VCSEL阵列通信模块的成本模型。分析结果是模型成本主要由外延材料成本驱动,激光产量将VCSEL阵列限制为小规模集成。

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