集成光子器件封装形式对器件性能的影响

摘要

集成光子器件封装过程中，波导芯片与阵列光纤对准耦合完成之后，需用紫外光固化胶进行固接，从而实现光路的互连。针对1×4通道平面波导芯片与阵列光纤的固接，以粘接区域为研究对象，通过-40～80℃的温度循环，采用有限元法分析各种固接形式的应力集中点、应力双折射、耦合损耗的变化规律及其因素；最后通过比较各种固接形式的仿真结果，得出结论，从而指导实验。结果表明：在-40～80℃范围内，温度对粘接面的应力双折射和耦合损耗的影响很小；双盖板固接形式对器件性能的影响最小，斜8°固接形式的效果最差。%For integrated photonic devices,it is necessary to bond planar optical waveguide chip and optical fiber array with UV curing adhesion after aligning and coupling.An 1 ×4-channel planar waveguide chip with an array of fiber fixedly connected to the bonding area was studied in this paper.By loading temperature cycling of-40 ℃to 80 ℃,the stress concentration,stress bire-fringence,and coupling loss factors for various solid forms were analyzed based on finite element method.The simulation compa-risions with different solid forms show that,temperature influence of the stress birefringence and coupling losses adhesive surface is small in-40 ℃to 80 ℃.The influence of double cover fixed to the forms of device performance is the smallest,and the fixed to 8 degrees oblique form has the worst bonding effect.