A DEVELOPMENT OF SUPER HIGH-PRESSURE MIC RO JET SYSTEM FOR PAD DRESSING AND POST-CMP CLEANING IN CMP PROCESS

摘要

This paper describes about design ways of the super high-pressure micro jet system using CMP process. The super high-pressure micro jet system that jets out micro de-ionized water, function water and chemical liquid with the pressure from 3MPa to 30Mpa and is used for pad dressing and cleaning wafer of post CMP. This pad dressing technique using the super high pressure micro jet system has the feature of effective recovering the choked surface of the polishing pad surface effectively without wear-out of the pad. And the super high-pressure micro jet system is the more efficient cleaning method than a conventional method and it adopts single-substrate cleaning process. As the super high-pressure micro jet system jets out microns droplets forward to cleaning object with high speed from a special nozzle, it has high cleaning ability. Therefore we must grasp the most suitable particle diameter and particle speed, so we try to measure them and design the system on the most suitable condition. Various experiments to confirm of pad dressing effect using super high-pressure micro jet method are made by us.