Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs

摘要

This paper systematically explores the underlying principle of a special domain and modal decomposition approach, and reports its latest advancement in modeling and simulation of multilayer packages and printed circuit boards for signal and power integrity analysis. Simulation results by different numerical techniques encompassed in the domain and modal decomposition approach are compared against those from measurement and full-wave simulation. The special domain and modal decomposition approach, compared with full-wave methods, exhibits faster simulation speed with good accuracy.