首页> 外文会议>Microelectronic Test Structures, 2009. ICMTS 2009 >Application of Matching Structures to Identify the Source of Systematic Dimensional Offsets in GHOST Proximity Corrected Photomasks
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Application of Matching Structures to Identify the Source of Systematic Dimensional Offsets in GHOST Proximity Corrected Photomasks

机译:匹配结构在GHOST邻近校正光掩模中识别系统尺寸偏移源的应用

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The effects of the GHOST proximity correction process on chrome-on-quartz photomasks can prove difficult to quantify and so they are not routinely characterised. This paper presents a methodology for addressing this issue using electrical test structures designed to measure dimensional mismatch. In the past these have been used successfully to characterise standard GHOSTed photomasks, which displayed systematic offsets that were not seen on an unGHOSTed mask using the same design. In order to investigate this further, a second mask was fabricated using a variation of the GHOST process which increased the resolution of the secondary exposure to be the same as the primary pattern. This enabled the source of the previously observed systematic offset to be determined as test structures on the new mask did not show the same overall dimensional bias. However, the range of mismatch in some of the structures was increased as a result of the new process.
机译:GHOST接近校正过程对石英上铬光掩模的影响可能难以量化,因此无法常规表征。本文提出了一种使用旨在测量尺寸失配的电气测试结构来解决此问题的方法。过去,这些已成功用于表征标准GHOSTed光罩,这些光罩显示的系统偏移量在使用相同设计的未GHOSTed光罩上看不到。为了进一步对此进行研究,使用GHOST工艺的变体制造了第二个掩模,该变体将二次曝光的分辨率提高到与主要图案相同。由于新掩模上的测试结构没有显示出相同的整体尺寸偏差,因此可以确定先前观察到的系统偏移的来源。但是,由于新工艺的影响,某些结构的不匹配范围增加了。

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