MEASUREMENTS OF THERMAL RESISTANCE OF PACKAGES FOR INTEGRATED CIRCUITS

摘要

A Measurement method of thermal resistance for IC packages is introduced, in which specially designed thermal test chip is utilized, and the junction-to-case steady-state thermal resistance of the devices under test is measured after devices with poor die attachment is screened out by measuring device thermal transient response under certain conditions, thus, package thermal resistance is represented by those steady-state thermal resistaneeof the devices.