Wafer-level high density integration of surface mount technology components in through-silicon trenches

摘要

This paper reports a novel method to deliver and assemble standard 01005 format (0.016” × 0.008”, 0.4 mm × 0.2 mm) monolithic ceramic capacitors and thin-film resistors into through-wafer trenches, with a batch assembly process that can guarantee 100% assembly. This process is CMOS compatible and is competitive with capacitors and resistors fabricated through standard foundry processes.