Electronic component mounting method for electronic module, involves installing electronic component on each substrate surface, and remelting component for simultaneously integrating surface and electronic components, at each surface

摘要

The method involves installing a substrate of a circuit or an electronic module, on a support (34), and depositing soldering paste on each of the substrate surfaces. An electronic component is installed on each surface. The surface and electronic components are remelted for simultaneously integrating the surface and electronic components, at each surface. An independent claim is also included for a radio communication module.