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Evaluation of 32-Bit carry-look-ahead adder circuit with hybrid tunneling FET and FinFET devices

机译:用混合隧道FET和FinFET设备评估32位携带前瞻加法器电路

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In this paper, we investigate the hybrid TFET-FinFET 32-bit carry-look-ahead adder (CLA) circuit and compare the delay, power and power-delay product (PDP) with all FinFET and all TFET implementations in near-threshold region. We use atomistic 3D TCAD mixed-mode simulations for transistor characteristics and HSPICE circuit simulations with look-up table based Verilog-A models calibrated with TCAD simulation results. In the hybrid design, TFETs are used for the top critical path to reduce the longest path delay, and FinFETs are used for the rest of the circuit to reduce switching power and leakage power. The PDP of the hybrid TFET-FinFET CLA circuit is better than the circuits with all FinFET and all TFET implementations in the vicinity of V=0.3V. However, as the operating voltage is further reduced, the lower-ranked critical paths (e.g. 2 critical path) with some FinFET devices in the path stick out, and the delay and PDP become inferior to all TFET implementation.
机译:在本文中,我们研究了混合TFET-FINFET 32位携带 - 前瞻加法器(CLA)电路,并将延迟,电源和电源延迟产品(PDP)与近阈值区域中的所有TFET实现进行比较。我们使用用于晶体管特性的原子3D TCAD混合模式模拟和具有查找表的Verilog-A校准TCAD仿真结果的模型。在混合设计中,TFET用于顶部关键路径以减少最长的路径延迟,并且FINFET用于其余的电路以降低开关功率和漏电。混合动力TFET-FINFET CLA电路的PDP优于所有FinFET的电路和V = 0.3V附近的所有TFET实现。然而,随着工作电压进一步减小,较低排名的关键路径(例如2临界路径)与路径中的一些FINFET器件伸出,并且延迟和PDP变为较差的所有TFET实现。

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