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Synthesis of ultrananocrystalline diamond films by microwave plasma assisted chemical vapor deposition system

机译:微波等离子体辅助化学气相沉积系统合成超晶金刚石薄膜

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Summary form only given. Microwave plasma assisted chemical vapor deposition (MPACVD) is one of the techniques used to grow ultrananocrystalline diamond (UNCD) films in the laboratory. UNCD films are characterized as smooth films consisting of few-10's nanometer sized crystals of diamond. The exceptional properties of these films, such as high hardness and chemical inertness combined with their small crystal size and smoothness and excellent mechanical properties such as high Young's modulus, fracture toughness and low coefficient of friction, have suggested applications as a protective, hard coating material, a material/substrate for micromechanical systems and a robust conducting coating for electrochemical electrodes. The objective of this study is to deposit both thin (less than 100 nm thick) and thick (~50 micrometer thick) UNCD films of high quality across 7.5 cm diameter substrates. In this paper we report on the development of process methods to grow UNCD films using a MPACVD system. Three different gas mixtures studied include H2:Ar:CH4, N2:Ar:CH4 and H2:He:CH4. For these three plasma discharges the process for UNCD film deposition is investigated over a wide pressure range (60-180 torr) and substrate temperature range (400-8000 C). UNCD films are grown on Si (100), p-type boron doped, substrates with thicknesses ranging from 58 nm to greater than 70 mum. The effect of various inputs such as feed gas mixture, pressure, substrate temperature and nucleation methods on growth rate, surface morphology, uniformity, and conductivity of UNCD diamond films is investigated. The highest growth rate of 1.12 mum/h was achieved at 180 torr, with gas mixtures of H2:Ar:CH4 = 4:100:2 seem and 3 kW microwave power. Film surface roughness, as low as 10 nm, was obtained as measured by AFM microscope
机译:摘要表格仅给出。微波等离子体辅助化学气相沉积(MPACVD)是用于在实验室中生长超晶金刚石(UNCED)薄膜的技术之一。 UNCOD薄膜的特征是光滑的薄膜,由少数10米的金刚石晶体组成。这些薄膜的特殊性质,例如高硬度和化学惰性,与它们的小晶体尺寸和光滑度和优异的机械性能相结合,例如高杨氏模量,断裂韧性和低摩擦系数,提出了应用作为保护性硬涂层材料,用于微机械系统的材料/基板和用于电化学电极的稳健导电涂层。本研究的目的是将薄(小于100nm厚)和厚(〜50微米厚)的高品质的UNC标号涂在7.5cm直径的基板上。在本文中,我们报告了使用MPACVD系统生长UND薄膜的过程方法的开发。研究的三种不同的气体混合物包括H2:Ar:Ch 4 ,n 2 :ar:ch 4 和h 2 :他:CH 4 。对于这三种等离子体放电,在宽的压力范围内(60-180托)和衬底温度范围(400-8000℃)来研究UNCLD膜沉积的方法。 UNCOD薄膜在Si(100),p型硼掺杂,厚度范围为58nm至大于70毫米的基板上。研究了各种输入,例如进料气体混合物,压力,衬底温度和成核方法对生长速率,表面形貌,均匀性和均匀性,表面形态,均匀性和导电性的影响。在180托的最高生长速率为1.12毫米/小时,具有H 2 :Ar:Ch 4 = 4:100:2似乎和3 kW的气体混合物微波功率。通过AFM显微镜测量获得薄膜表面粗糙度,低至10nm

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