Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing

摘要

The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design specific activity. The implementation and use of a standardized set of solder joint modification configurations on an industrywide basis would be cost effective and promote industry consistent modification practices. A set of 14 commonly used IPC Class 3 modification configurations were selected for investigation. Thermal cycle testing was chosen to evaluate the solder joint thermal cycle fatigue reliability of the configuration set. A total of 1,972 thermal cycles using a -55°C to +125°C recipe in accordance with the IPC-9701 guidelines were completed. Failure analysis and photo-documentation were conducted characterizing modification configuration solder joint geometries and wetting angles. The investigation results/recommendations were disseminated to the IPC-A-610 and IPC-7711/7722 specification committees for potential use.