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Low-temperature epitaxial growth of in-situ heavily b-doped Si_(1-x)Ge_x films using ultraclean LPCVD

机译:使用超薄LPCVD的低温外延生长原位的较重B掺杂Si_(1-X)Ge_x膜

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In-situ heavy doping of B into Si_(1-x)Ge_x epitaxial films on the Si(100) substrate have been investigated at 550 deg C in a SiH_4(6.0Pa)-GeH_4(0.1-6.0Pa)-B_2H_6(1.25x10~(-5)-3.75x10~(-2)Pa)-H_2(17-24Pa) gas mixture by using an ultraclean hot-wall low-pressure CVD system. The deposition rate increased with increasing GeH_4 partial pressure, and it decreased with increasing B_2H_6 partial pressure only at the higher GeH_4 partial pressure. As the B_2H_6 partial pressure increased, the Ge fraction scarcely changed although the alttice constant of the film decreased. These characteristics can be explained by the suppression of both the SiH_4 and GeH_4 adsorption/reactions in a similar degree due to B_2H_6 adsorption on the Si-Ge and/or Ge-Ge bond sites. The B concentration in the film increased proportionally up to 10~(22)cm~(-3) with increasing B_2H_6 partial pressure.
机译:在SiH_4(6.0Pa)-geH_4(0.1-6.0Pa)-b_2H_6(1.25 X10〜(-5)-3.75x10〜(-2)PA)-H_2(17-24PA)气体混合物通过使用超薄热壁低压CVD系统。 随着GEH_4分压的增加而增加,沉积速率增加,并且仅在较高的GEH_4部分压力下增加B_2H_6分压。 随着B_2H_6分压增加,虽然薄膜的ALTTICE常数降低,但GE部分几乎没有变化。 由于Si-Ge和/或Ge-ge键键位点上的B_2H_6吸附,通过抑制SIH_4和GEH_4吸附/反应的抑制来解释这些特征。 膜中的B浓度比增加B_2H_6分压成比例增加至10〜(22 )cm〜(-3)。

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