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Low-temperature epitaxial growth of in-situ heavily b-doped Si_(1-x)Ge_x films using ultraclean LPCVD

机译:使用超净LPCVD低温原位重掺杂b掺杂的Si_(1-x)Ge_x薄膜的低温外延生长

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In-situ heavy doping of B into Si_(1-x)Ge_x epitaxial films on the Si(100) substrate have been investigated at 550 deg C in a SiH_4(6.0Pa)-GeH_4(0.1-6.0Pa)-B_2H_6(1.25x10~(-5)-3.75x10~(-2)Pa)-H_2(17-24Pa) gas mixture by using an ultraclean hot-wall low-pressure CVD system. The deposition rate increased with increasing GeH_4 partial pressure, and it decreased with increasing B_2H_6 partial pressure only at the higher GeH_4 partial pressure. As the B_2H_6 partial pressure increased, the Ge fraction scarcely changed although the alttice constant of the film decreased. These characteristics can be explained by the suppression of both the SiH_4 and GeH_4 adsorption/reactions in a similar degree due to B_2H_6 adsorption on the Si-Ge and/or Ge-Ge bond sites. The B concentration in the film increased proportionally up to 10~(22)cm~(-3) with increasing B_2H_6 partial pressure.
机译:在550°C的SiH_4(6.0Pa)-GeH_4(0.1-6.0Pa)-B_2H_6(1.25)中研究了在Si(100)衬底上的Si_(1-x)Ge_x外延膜中B的原位重掺杂x10〜(-5)-3.75x10〜(-2)Pa)-H_2(17-24Pa)气体混合物,使用超净热壁低压CVD系统。仅在较高的GeH_4分压下,沉积速率随GeH_4分压的增加而增加,而随B_2H_6分压的增加而降低。随着B_2H_6分压的增加,尽管膜的高度常数减小,但Ge分数几乎不变。这些特性可以通过抑制SiH_4和GeH_4的吸附/反应来解释,这归因于在Si-Ge和/或Ge-Ge键位上的B_2H_6吸附。随着B_2H_6分压的增加,薄膜中的B浓度成比例地增加到10〜(22)cm〜(-3)。

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