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Application of The Second Generation of SACM in Both Solder Sphere and Solder Paste – (PPT)

机译:第二代SACM在两种焊料球和焊膏中的应用 - (PPT)

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SAC0510M ~ SAC105 in melting. SAC0510M/SAC105 sphere: > 2X in DBT, > 8X in modified JEDEC drop test, ~40-60% better in TCT (-55°C/125°C), TCT of SAC0510M may outperform SAC305. The reduced hardness and much thinner and stable IMC layer on Ni are responsible for the superior non-fragility, while the stabilized IMC and grain microstructure are responsible for the TCT performance. Thinner IMC layer on Ni is more important than reduced hardness in improving non-fragility. High Tg brittle laminate can cause pad cratering.
机译:SAC0510M〜SAC105熔化。 SAC0510M / SAC105球体:> 2x在DBT中,> 8x在改装JEDEC滴测试中,TCT(-55°C / 125°C)中〜40-60%,SAC0510M的TCT可能优于SAC305。在Ni上的降低的硬度和更薄的IMC层对优异的非脆性负责,而稳定的IMC和晶粒微观结构负责TCT性能。 Ni上的较薄IMC层比改善非脆弱性的硬度更为重要。高Tg脆性层压板可导致垫升降机。

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