Large area solder application - involves application of solder repellant grid over silvering paste and dip or flow soldering

摘要

The substrates of thin-or thick-film semiconductor modules and the cooling elements of electronic circuits require the application of large areas of solder. This can be achieved combined with a perfectly uniform distribution of the solder by applying a grid of a material which is not wetted by solder. The carrier (1) is first thoroughly cleaned on the areas concerned, followed by the application of a silvering paste (3). A grid (4), made of a material such as solder stop lacquer, is printed on it, and the soldering by a dip or flow soldering process concludes the operation. This produces uniformly distributed cup-shaped projections of solder (6).