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Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications

机译：用于微型电子包装应用的环氧聚合物焊膏

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Ashutosh Sharma; Do Hyun Jung; Ju Seon Cheon; Jae Pil Jung;
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年度 2019
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1. Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications [J] . Sharma Ashutosh, Jang Young-Joo, Kim Jang Baeg, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2017,第期

机译：环氧嵌入式SN-3.0AG-0.5CU（SAC305）焊膏的热循环，剪切和绝缘特性进行汽车应用
2. Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-AI(30 ppm)Solder Paste in a Lead-Free Wafer Level Chip Scale Package [J] . Huann-Wu Chiang, Jun-Yuan Chen, Jeffrey C.B.Lee, Journal of Electronic Materials . 2004,第12期

机译：无铅晶圆级芯片级封装中的Sn-4Ag-0.5Cu焊球和Sn-7Zn-AI（30 ppm）焊膏的焊点界面反应研究
3. Transfer Paste for 3D Package on Package (PoP) Packaging Prevents Incomplete Soldering [J] . Asia electronics industry . 2012,第9期

机译：封装（PoP）封装上3D封装的转移膏可防止焊接不完全
4. High reliability gold based solder alloys for micro-electronics packaging for high temperature applications [C] . Chidambaram Vivek, Yeung Ho Beng, Shan Gao 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits . 2012

机译：用于高温应用的微电子封装的高可靠性金基焊料合金
5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

机译：用于电子组装和包装的新型PB无铅纳米复合材料焊膏的合成，制剂和可靠性研究
6. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints [O] . Min-Soo Kang, Do-Seok Kim, Young-Eui Shin 2019

机译：在Sn-Ag-Cu和Sn-Bi焊点中添加环氧聚合物的影响
7. Recent Trends in Noble Metal Nanoparticles for Colorimetric Chemical Sensing and Micro-Electronic Packaging Applications [O] . Anurag Gautam, Pragya Komal, Prabhat Gautam, 2021

机译：比色化学传感和微型电子包装应用的贵金属纳米粒子的近期趋势

Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications

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