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Three-Dimensional High-order Nano-rod Formation Using a Hydrogen-assisted Deep Reactive Ion Etching

机译:使用氢气辅助深反应离子蚀刻的三维高阶纳米棒形成

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We report the formation of three-dimensional nano-sized vertical features on silicon and amorphous silicon films by means of a hydrogen-assisted deep reactive ion etching. The thickness of amorphous silicon has been varied between 5 and 10μm. The adhesion quality of relatively thick amorphous Si films has allowed deep micro and nano-machining features on silicon and glass substrates. Apart from optical photo-lithography, high precision nano-sphere colloidal lithography and electron beam lithography has been exploited to realize ultra-small features on the amorphous silicon. Scanning electron microscopy has been extensively used to study the evolution of three-dimensional features. Such 3-D structures are suitable for future MEMS and NEMS-based devices on glass and silicon substrates.
机译:我们通过氢辅助深反应离子蚀刻报告硅和非晶硅膜上的三维纳米型垂直特征的形成。非晶硅的厚度在5到10μm之间变化。相对厚的无定形Si薄膜的粘合质量允许在硅和玻璃基板上允许深微型微型和纳米加工特征。除了光学光刻外,高精度纳米球胶体光刻和电子束光刻已经利用,实现了非晶硅上的超小功能。扫描电子显微镜已被广泛地用于研究三维特征的演变。这种3-D结构适用于玻璃和硅基板上的未来MEMS和NEMS的设备。

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