An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)

摘要

A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders on two kinds of metals were investigated using an optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24°.