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The effects of sample preparation on electron holography of semiconductor devices

机译:样品制备对半导体器件电子全能的影响

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Focused ion beam (FIB) milling and small angle cleaving have been used to prepare semiconductor specimens for examination using electron holography. The experimental results illustrate the effects of sample preparation on the electrostatic potential distribution in a silicon p-n junction sample. The importance of biasing experiments when examining FIB-prepared semiconductor samples is highlighted.
机译:聚焦离子束(FIB)铣削和小角度切割已被用于制备半导体样本以使用电子全息术检查进行检查。实验结果说明了样品制备对硅P-N结样品中静电电位分布的影响。突出了检查制备的半导体样品时偏置实验的重要性。

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