FLUX MEDIUM AND VOIDING: AN EMPIRICAL STUDY

摘要

Despite the controversial influence of voids on the solder joint reliability, minimal voiding remains highly desirable in SMT assemblies. Excess void formation may jeopardize the useful lifetime and performance of components operating at high temperature due to compromised thermal dissipation. It is generally accepted that solder paste formulation strongly influences void formation. This study will examine the influence of three attributes of paste formulation on BTC void formation, namely thermal profile, flux activity and surface tension. These three variables are significant as they are quantifiable/continuous allowing for empirical mapping of voiding as a function of these attributes.