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Low voiding no flow fluxing underfill for electronic devices
Low voiding no flow fluxing underfill for electronic devices
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机译:电子设备的低空洞无助焊剂底部填充
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摘要
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
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