Transient thermal simulation and thermal testing for PCBA control system

摘要

Based on typical life cycle of thermal stress profile, this paper calculates transient temperature distributions of PCBA control system at different times by 3-D finite element analysis. The weak components sensitive to thermal stress are determined though thermal analysis. Then, we get the thermal distributions of the circuit board at different times by using infrared imaging devices on working condition, and results obtained from finite element program are compared with the test. The research provide beneficial references for improving weak links.