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Determination of Band Structure at GaAs/4H-SiC Heterojunctions

机译:GaAs / 4H-SiC异质结的频带结构的测定

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The effects of thermal annealing process on the interface in p+-GaAs/n-4H-SiC heterojunctions fabricated by using surface-activated bonding (SAB) were investigated. It was found by measuring their current-voltage (I-V) characteristics that the reverse-bias current and the ideality factor were extracted to be 7.57 × 10~(-7) A/cm~2 and 1.33, respectively, for the junctions annealed at 400°C. The flat-band voltage obtained from capacitance-voltage (C-V) measurements was found to be 1.29 eV, which is almost consistent with the turn-on voltage extracted from I-V characteristics. These results suggest that the SAB-based GaAs/4H-SiC heterojunctions are applicable for fabricating high-frequency power devices.
机译:研究了通过使用表面活性粘合(SAB)制造的P + -GAAs / N-4H-SiC杂交界界面上的热退火处理的影响。通过测量它们的电流 - 电压(IV)特性,即分别提取反向偏置电流和理想因子的特性,分别为11.57×10〜(-7)A / cm〜2和1.33,以便在退火时400°C。从电容 - 电压(C-V)测量获得的平坦带电压是1.29eV,几乎一致地与从I-V特性提取的开启电压一致。这些结果表明,基于SAB的GAAS / 4H-SIC杂交功能适用于制造高频功率器件。

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