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Monolithic integration of Ⅲ-Ⅴ As- and P-based devices on Si through direct MBE growth and using lattice engineered substrates

机译:通过直接MBE生长和使用格子工程基材的Si上基于Ⅲ-ⅴ和P型器件的单片集成

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Monolithic integration of Ⅲ-Ⅴ material with Si have shown great potential to improve characteristics of integral circuits by increasing operational frequencies, reducing power consumption and, potentially, by replacing electrical interconnections with optoelectronic lines to increase data transfer speed. In this paper we discuss the integration of InP lattice parameter based quantum well field effect transistors and heterojunction bipolar transistors on Si via direct growth on Si substrates and using Silicon-on-lattice-engineered substrates. Main focus is on improvement of structural quality and reduction of epi-layer defects and dislocation density. The epi-layer transport properties and single transistor performance fabricated on Si was compared to references on InP substrates.
机译:通过替换具有光电线路的电互连来提高数据传输速度来提高数据传输速度来提高电互连,可以通过增加电互连来提高积分电路的特性,从而提高数据传输速度来提高电互连以提高数据传输速度的电互连,从而显着施加巨大的潜力。本文讨论了INP格子参数基量阱场效应晶体管和异质结双极晶体管在Si基板上的直接生长和使用硅片工程衬底的集成。主要重点是提高结构质量和脱位缺陷和脱位密度的降低。将Si制造的外延层传输性和单晶体管性能进行比较,与INP衬底的引用进行了比较。

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