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Monolithic integration of Ⅲ-Ⅴ As- and P-based devices on Si through direct MBE growth and using lattice engineered substrates

机译:通过直接MBE生长并使用晶格工程衬底将Ⅲ-ⅤAs和P基器件单片集成到硅上

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Monolithic integration of Ⅲ-Ⅴ material with Si have shown great potential to improve characteristics of integral circuits by increasing operational frequencies, reducing power consumption and, potentially, by replacing electrical interconnections with optoelectronic lines to increase data transfer speed. In this paper we discuss the integration of InP lattice parameter based quantum well field effect transistors and heterojunction bipolar transistors on Si via direct growth on Si substrates and using Silicon-on-lattice-engineered substrates. Main focus is on improvement of structural quality and reduction of epi-layer defects and dislocation density. The epi-layer transport properties and single transistor performance fabricated on Si was compared to references on InP substrates.
机译:Ⅲ-Ⅴ族材料与Si的单片集成显示出巨大的潜力,可以通过增加工作频率,降低功耗以及潜在地通过用光电线路代替电气互连来提高数据传输速度来改善集成电路的特性。在本文中,我们讨论了基于InP晶格参数的量子阱场效应晶体管和异质结双极晶体管在Si衬底上的集成,方法是在Si衬底上直接生长并使用硅晶格工程衬底。主要重点是提高结构质量,减少外延层缺陷和位错密度。将在Si上制造的磊晶层传输特性和单晶体管性能与InP衬底上的参考材料进行了比较。

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