Finite Element Modeling of Intermetallic Compound(IMC) Solder Joints Fracture: Part A

摘要

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. This paper presents a finite element modeling of intermetallic compounds solder joints failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack on intermetallic IMC solder joints is presented.