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Understanding parasitic effects to improve the amp;#x201C;3amp;#x03C9;amp;#x201D; measurement of GaN HEMTs thermal impedance

机译:了解寄生效应,改进“ 3ω” GaN Hemts热阻抗测量

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The thermal impedance of Gallium Nitride based High Electron Mobility Transistors (GaN HEMTs) has been characterized using the “3ω method”. The method was initially proposed by D.G. Cahill to measure the thermal conductivity of bulk materials or layers. We already demonstrated in a previous work that under certain conditions the voltage oscillation at the third harmonic is the real image of the thermal impedance of the device in the frequency domain. In this work, we propose both a theoretical approach to understand the limitation of our 3ω test bench and a comparison with measurements.
机译:使用“3Ω方法”表征了氮化镓基高电子迁移率晶体管(GaN HEMT)的热阻抗。最初由D.G提出该方法。 Cahill测量散装材料或层的导热率。我们已经在先前的工作中展示,在某些条件下,第三次谐波的电压振荡是频域中器件的热阻抗的真实图像。在这项工作中,我们提出了理论方法,了解我们的3Ω测试台的限制和与测量的比较。

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