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Properties of I-doped CuI Thin Films by Chemical Vapor Deposition (CVD)

机译:化学气相沉积(CVD)I掺杂铜薄膜的性质

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摘要

In this paper, we present the properties of I-doped CuI thin films at different concentration of iodine dopant (e.g. 10mg, 20mg, 30mg, 40mg and 100mg). The doping of CuI was done by using double furnace chemical vapor deposition (CVD) method. The effects of I-doped CuI to its surface morphology and electrical were studied. The effect of iodine doping to surface morphology was measured by field emission scanning electron microscopy (FESEM). The morphology of all thin films shows insignificance changes in grain size, grain boundaries and particle structure as the doping concentration varies. For the electrical properties, high current at constant voltage of -5V to 5V was obtained. The resistivity of 10~(-1) was obtained for undoped CuI thin films. While, for the series of I-doped CuI thin films, the resistivity of 10~(-2) was obtained. The excess of hole conductor in the I-doped CuI thin films enhances the electrical conductivity of the films.
机译:在本文中,我们介绍了不同浓度的碘掺杂剂(例如10mg,20mg,30mg,40mg和100mg)的I-掺杂的铜薄膜的性质。通过使用双炉化学气相沉积(CVD)方法来完成Cui的掺杂。研究了I-掺杂Cui对其表面形态和电气的影响。通过现场发射扫描电子显微镜(FESEM)测量碘掺杂对表面形态的影响。所有薄膜的形态显示晶粒尺寸,晶界和颗粒结构随着掺杂浓度变化而变化的微不足平。对于电性能,获得了恒定电压为-5V至5V至5V的高电流。为未掺杂的铜薄膜获得10〜(-1)的电阻率。虽然,对于一系列I掺杂的Cui薄膜,得到10〜(-2)的电阻率。 I掺杂的Cui薄膜中的过量孔导体增强了薄膜的电导率。

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